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Key improvements in precision machining of difficult-to-cut materials

Topic      :Key improvements in precision machining of difficult-to-cut materials
Speaker :Dr. Yilong Wang
Time       :December 12, 2017  15:00      

Location:The First Meeting Room of CAS Key Laboratory of Optical System Advanced Manufacturing Technology

Hosted by: Key Laboratory of Optical System Advanced Manufacturing Technology

 

Report's Abstract:

Requirements for high-dimensional precision and optical quality surfaces as well as a decrease in costs and cycle time in die and mold manufacturing are rapidly increasing. Die and mold manufacturing represents a significant link in the entire production chain. The production of nearly all mass produced discrete parts utilizes dies and molds. Therefore, the quality of the dies and molds directly affects the quality of the produced parts. In this talk, the latest machining technologies and details that related to the promising machining methods, such as thermal-chemical based diamond machining, ultrasonic vibration-assisted machining, and high speed mirror surface machining of difficult-to-cut materials, e.g., hardened steel and hard and brittle materials and advanced ceramics, will be discussed.  

 

Speakers' CV:

Yilong Wang completed a joint Doctorate Degree in Mechanical Engineering at Harbin Institute of Technology, China and Nagoya University, Japan. His professional accomplishments include 6 patents, 12 Peer Reviewed Journal Papers and 7 Proceedings in precision/ultra-precision machining areas. He is now a Research & Development Engineer and Project Leader at Makino Milling Machine Co. Ltd. Japan (Makino) and, is responsible in developing ultrasonic vibration-assisted machining processes and systems for precision/ultra-precision machining of difficult-to-machine materials, like hardened steel, tungsten carbide, glass, silicon carbide and other advanced ceramics. Prior to joining Makino, he worked as an assistant professor at Nagoya University, Japan. He has successfully led teams in developing ultrasonic vibration spindle, 2D ultrasonic vibration-assisted machining systems and high speed milling system from concepts to applications.




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